Many semiconductor manufacturers often miss the essence by only looking at the ‘surface’ of the laminator system. While they are proactive in adopting advanced equipment, they neglect to keep that equipment clean. As a result, no matter how good a laminator is, you may face the following issues:
- Fail to prevent an increase in defect rate due to micro-contaminants
- Stagnant production productivity without improvement
- Receiving quality complaints from customers
Perhaps the solution to the problem your company is facing is not advanced equipment, but overlooked ‘cleaning’.
Semiconductor Micro-Contamination Issues and Huvics’s Cleaning Technology
Severity of Semiconductor Micro-Contamination
The semiconductor manufacturing process demands a level of precision akin to ‘microscopic art.’ Even a tiny speck of dust or organic contaminant can lead to critical defects in products. Especially, the laminator system, which precisely attaches thin films to the substrate, is a key step that influences semiconductor performance. The invisible micro-contaminants generated during this process significantly increase the defect rate in the final product. Many manufacturers either overlook the severity of these micro-contaminants or struggle to find effective countermeasures.
Importance of Huvics’s Cleaning Technology
Huvics has focused on this point. Just as much as the performance of the laminator system itself, ‘cleaning technology’ to keep the system clean is a decisive factor. Beyond simply removing contaminants, Huvics focuses all its efforts on drastically reducing defect rates and stably maintaining the quality of the final product through high-performance cleaning technology.
Unique Multi-stage Cleaning Technology
Huvics’s laminator system goes beyond simple equipment. Based on ultra-precision processing technology, it maximizes process efficiency and is positioned as an integrated solution that simultaneously enhances productivity and yield through customized designs reflecting the unique requirements of customer companies. In particular, the Cleaner Machine, which applies the following unique multi-stage cleaning technology, significantly contributes to defect rate reduction by perfectly removing contaminants from the product surface.
- Micro Bubble technology delicately detaches micro-contaminants
- Water Jet technology thoroughly washes away contaminants and residues
- Air Knife technology quickly dries surface water droplets
Values and Vision of Huvics
Ultimately, Huvics aims for the following:
- Securing the best quality that customers desire through cutting-edge technology
- Increasing overall productivity by enhancing production efficiency
- Ultimately supporting the successful business of customers
The laminator cleaning technology embodies Huvics’s unwavering values and a strong will to contribute to the sustainable growth of the semiconductor industry.
Working Principle of Huvics Multi-stage Precision Cleaning Technology
Components of Precision Cleaning Technology
The semiconductor manufacturing process consists of a series of delicate operations dealing with circuits thinner than a hair strand. In such a precise environment, a small contaminant particle can degrade the performance of the entire chip like an ink drop in clear water, leading to massive defects. To address this critical problem, Huvics provides innovative laminator system cleaning technology, with a differentiated approach integrating the following three precision cleaning stages at its core:
- Micro Bubble Cleaning: Precisely and powerfully detaches contaminants with micro bubbles, removing even invisible pollution sources.
- Water Jet Cleaning: Cleanses contaminants and micro residues thoroughly with precisely controlled water streams.
- Air Knife Drying: Quickly removes surface water droplets with compressed air, preventing defect-inducing water stains.
This multi-stage cleaning technology plays a decisive role in dramatically reducing the defect rate of semiconductor processes.
Core Values of Huvics for Customer Success
Huvics’s laminator system significantly contributes to reducing defect rates in semiconductor processes with its organic multi-stage cleaning technology. Beyond simply cleaning, supporting customers to achieve the ultimate goal of enhanced production efficiency and improved product quality is the core value of Huvics.
Synergy of Defect Rate Reduction, Quality Improvement, and Automation
Importance of Defect Rate Reduction and Quality Improvement
The significance of laminator system cleaning technology in semiconductor processes boils down to these two core values:
- Dramatically reduce defect rates by removing micro-contaminants
- Enhance final product quality by boosting semiconductor chip performance and reliability
As we enter the era of ultra-high integration, semiconductor chips now have circuits and structures of a fineness we couldn’t have imagined in the past. In this environment, each micro-contaminant directly affects the performance and reliability of semiconductors, making flawless and comprehensive cleaning not a choice but an essential survival condition. Contaminants primarily cause the following issues:
- Damage the appearance of the chip and degrade aesthetics
- Impede electrical characteristics, leading to performance degradation
- Weaken thin film adhesion, causing defects
Core Effects of Huvics Technology
Huvics’s laminator system cleaning technology perfectly meets these stringent industry demands. This technology focuses beyond merely wiping dust off surfaces, targeting the following core objectives:
- Maximizing thin film adhesion for secure attachment
- Significantly improving electrical characteristics for performance enhancement
By fundamentally removing contaminant particles, it ensures more secure and uniform adhesion of thin films to substrates, guaranteeing the chip’s long-term reliability. For instance, the following effects can be expected:
- Smoother current flow by removing fine residual contaminants
- Increased operation speed and efficiency of semiconductor devices
Automation System for Cleaning Process
Furthermore, Huvics actively adopts an automation system to maximize the efficiency of the cleaning process. This automation system minimizes human intervention, providing the following critical contributions:
- Significantly reduces the possibility of errors due to operator intervention
- Consistently maintains stable quality standards for each process
This results in the following effects:
- Enhanced overall productivity through the adoption of an automation system
- Cost-saving benefits from efficient process management
Synergy Effect of Automation and Defect Rate Reduction
Defect rate reduction and automation create the following virtuous cycle:
- Increase production efficiency by reducing rework due to defect rate reduction
- Maximize efficiency by shortening process time with automation
- Create a virtuous cycle of reinvesting saved costs in research and development
Ultimately, these innovations bring about the following positive effects:
- Strengthen the company’s competitiveness to secure market leadership position
- Create a positive ripple effect throughout the semiconductor industry
- Contribute to leading technological advancements domestically and internationally
Continuous Technical Innovation and Contribution
Through relentless technical innovation, Huvics strives to support the successful business of its customers and further contribute to strengthening the global competitiveness of Korea’s semiconductor industry.
Varied Application Fields and Customized Solutions
Broad Application Fields and Excellent Effects
As we explored earlier, defect rate reduction in semiconductor processes is a core task for technological innovation and future competitiveness. As a solution to these challenges, Huvics is drawing attention in the industry by introducing its innovative laminator system cleaning technology. What makes Huvics’s laminator system cleaning technology special are its wide application range and excellent effects. This technology has a strong advantage of being effectively applicable to various semiconductor manufacturing processes, especially highly complex packaging processes. For instance, applying this precision cleaning technology to advanced package manufacturing processes such as the following can yield noticeable yield improvements:
- Advanced package manufacturing like FCBGA (Flip Chip Ball Grid Array)
- Application to WLCSP (Wafer Level Chip Scale Package) processes
- QFN/DFN (Quad Flat No-leads / Dual Flat No-leads) manufacturing process
This is because it perfectly removes contaminants between fine bumps or lead frames, preventing adhesion defects or electrical shorts. Additionally, it demonstrates excellent effects in cleaning optical and electronic components such as the following:
- Cleaning optical components with high precision requirements like camera modules
- Precision cleaning of various electronic components such as sensors and VCM motors
This contributes to taking product reliability and performance to the next level.
Customized Solutions and Technical Support
Based on this broad applicability, Huvics continually focuses on customized equipment design to meet the diverse needs of customers. Huvics spares no technical support to maximize the productivity and yield of its customer companies by:
- Closely analyzing the characteristics of specific production lines
- Accurately identifying the unique requirements of the product
- Providing optimized laminator systems tailored to each need
- Technical support to maximize productivity and yield
This demonstrates Huvics’s strong commitment to not just selling high-performance products, but striving for genuine success perfectly integrated into each customer’s unique production environment. By contemplating customer problems together and proposing solutions, Huvics faithfully fulfills its role not only as a supplier but as a strategic partner.
Continuous Research and Future Vision
Huvics will continue to research and develop its laminator cleaning technology to play a central role in opening a bright future for the semiconductor industry. Huvics’s ultimate goal and vision are as follows:
- Support customers’ successful business with advanced technological innovation
- Actively contribute to the continuous growth of the semiconductor industry at home and abroad
Many still endure massive losses due to micro-contamination issues in semiconductor processes, but these challenges are no longer inevitable. Huvics’s innovative laminator system cleaning technology provides the following effects through sophisticated multi-stage cleaning:
- Dramatically reduce defect rates to increase production efficiency
- Maximize final product quality to strengthen competitiveness
Ultimately, in the semiconductor industry of the ultra-high integration era, perfect cleaning is an essential value.
- Essential value for enhancing customer production efficiency
- Essential value determining competitiveness in the global market
Through these technological innovations, Huvics will drive successful customer business and open a brighter future for the semiconductor industry.
Huvics is a high-tech company developing and manufacturing automation equipment and production systems across the semiconductor, LED, Mobile, and Cosmetic industries.
With the best talent and continuous technological innovation, we support our customers’ productivity improvement and quality competitiveness.
Contact Huvics Co., Ltd.
Phone: 031-374-8285
Email: cdpark@huvics.com
