As semiconductor technology advances and circuit patterns become extremely miniaturized, the cleaning phase, which is key in the manufacturing process, has faced new challenges. In the past, the process largely relied on physical friction or strong chemical agents, but these traditional methods have shown the following limitations:
- There was a high risk of damaging the delicate substrates.
- It was difficult to completely remove ultrafine contaminants lodged in the micropattern gaps.
In semiconductor manufacturing, even a single tiny contaminant particle can lead to critical defects, threatening yield and quality. Therefore, there is a pressing need for innovative cleaning technology that removes micro contaminants without damaging the product and ensures stability in final quality. This is not merely a simple improvement, but a necessary change that determines the future of the semiconductor industry.
Principle of Micro Bubble Cleaning Technology
An innovative solution to overcome the chronic limitations of existing cleaning methods is Huvics’ micro bubble cleaning technology. This technology is based on the principle of generating a large number of ultrafine bubbles, measuring less than tens of micrometers (μm), in a liquid. These ultrafine bubbles penetrate deeply between particles delicately attached to the contaminated surface, reaching areas unseen by the naked eye. As the bubbles burst, the resulting powerful ‘cavitation’ phenomenon effectively separates and removes contaminant particles from the substrate without physical damage. It is a scientific process that drastically reduces defect rates by perfectly removing even micro contaminants invisible to the naked eye, without posing any threat to semiconductor substrates. Consequently, Huvics’ micro bubble cleaning provides an advanced solution that simultaneously tackles two key challenges:
- Effectively removes micro contaminants to enhance cleanliness
- Perfectly prevents physical damage to semiconductor substrates
Resolving Core Challenges and Enhancing Productivity
This plays a decisive role in enhancing productivity and yield in the semiconductor industry.
Differences and Effects from Traditional Methods
Huvics’ micro bubble cleaning shows clear differences and proves its superiority compared to traditional methods. While traditional cleaning methods relied on physical friction and strong chemical agents to remove contaminants, Huvics’ micro bubble cleaning fundamentally differs through its ‘non-contact method’. This means contaminants from deep within can be delicately removed using cavitation without any physical contact with intricate micro patterns. These effects, in particular, play a decisive role in reducing defect rates and ensuring quality stability in the semiconductor manufacturing process.
- Significantly improves the removal efficiency of submicron-sized particles
- Remarkably reduces defect rates and ensures stability in final product quality
Application Fields for Various Precision Component Cleanings
This innovative cleaning method has emerged not only as a solution optimized for semiconductor wafers but also for the cleaning of the following precise and delicate components:
- Cleaning of key components like semiconductor wafers
- Precision cleaning processes for camera modules
- Cleaning of various types of precision sensor chips
- Cleaning of micro driving components like VCM motors
- Complete cleaning of component transport trays
Huvics contributes to maximizing customer product value and increasing productivity through these advanced solutions.
With semiconductor processes becoming extremely miniaturized, the limitations of existing cleaning methods are no longer tolerable. Responding to this pressing need, Huvics’ micro bubble cleaning technology, a non-contact method that eliminates micro contaminants without physical damage, has captured both quality stability and yield enhancement. Now established as the new standard for cleaning delicate advanced components, this innovative solution will provide a clean and robust foundation essential for future technological development.
Huvics is a high-tech company specializing in the development and manufacturing of automation equipment and production systems across the semiconductor, LED, mobile, and cosmetic industries. We support the improvement of customer productivity and quality competitiveness with top-notch personnel and continuous technological innovation.
Contact Huvics
Phone: 031-374-8285
Email: cdpark@huvics.com
